Physical Vapor Deposition (PVD) technology refers to the use of physical methods under vacuum conditions to vaporise the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partially ionised into ions, and to deposit a thin film with a particular function on the surface of a substrate through a low pressure gas (or plasma) process, Physical Vapor Deposition is One of the main surface treatment techniques. PVD (Physical Vapour Deposition) coating technology is divided into three main categories: vacuum evaporation coating, vacuum sputtering coating and vacuum ion coating. The main methods of physical vapour deposition are: vacuum evaporation coating, sputtering coating, arc plasma coating, ion coating and molecular beam epitaxy. The corresponding vacuum coating equipment includes vacuum evaporation coaters, vacuum sputtering coaters and vacuum ion coaters. Read More

PVD (Physical Vapor Deposition) technology is one of the main techniques used to prepare thin film materials, and the substances used to prepare them are known as PVD coated materials. Sputtering and vacuum evaporation coating are the two most dominant PVD coating methods. Read More

Physical Vapour Deposition (PVD) is a technique that uses physical methods under vacuum to vaporise the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partially ionise them into ions, and deposit a thin film with a specific function on the surface. This article will also introduce the basic principles and characteristics of pvd. Read More