PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition) are two major thin-film coating technologies. PVD vaporizes materials through physical means (e.g., heating or sputtering), resulting in strong adhesion but slower deposition rates. CVD forms coatings via chemical reactions, off
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PVD and CVD are the most commonly used surface treatment methods for tools and moulds, CVD is based on chemical vapour deposition and PVD is based on physical vapour deposition, as they differ in principle, the final coating results are different and each has its own focus in application.
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PVD stands for Physical Vapour Deposition. PVD coating refers to a thin film deposition technique whereby solid materials are sputtered or evaporated in a vacuum environment and deposited as pure materials or alloy components to form a coating on a substrate.
Views: 30 Author: Site Editor Publish Time: 2022-05-16 Origin: Site
PVD (Physical Vapor Deposition) technology is one of the main technologies for the preparation of thin film materials, using physical methods under vacuum conditions to vaporise a material into gaseous atoms, molecules or partially ionised ions, and through a low-pressure gas (or plasma) process, deposit on the surface of the substrate material with special functions such as increased permeability, reflection, protection of electrical conductivity, magnetic conductivity, insulation, corrosion resistance The technology of depositing thin film materials with special functions such as permeability enhancement, reflection, protection against electrical conductivity, magnetic conductivity, insulation, corrosion resistance, oxidation resistance, radiation protection and decoration on the surface of substrate materials. The substances used to prepare the thin film materials are called PVD-coated materials. Sputtering and vacuum evaporation are the two most mainstream PVD coating methods.
Sputtering targets are characterised by high purity, high density, multi-component and uniform grain size and generally consist of a target blank and a backing plate. The target blank is the core part of the sputtering target and is the target material to be bombarded by the high speed ion beam. After the target blank is struck by ions, its surface atoms are sputtered out and deposited on the substrate to make electronic films. Due to the low strength of high purity metals, sputtering targets require a high voltage, high vacuum machine environment to complete the sputtering process. The sputtering target blanks of ultra-high purity metals need to be joined by different welding processes with the backing plate, which mainly serves to hold the sputtering target in place and needs to have good electrical and thermal conductivity.
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Depending on the raw material used, sputtering targets can be divided into metallic/non-metallic monolithic targets, alloy targets, compound targets, etc. The sputtering coating process is reproducible, the thickness of the film can be controlled, can be obtained on a large area of the substrate material uniform thickness of the film, the prepared film has the advantages of high purity, good density, strong bonding with the substrate material, etc., has become one of the main technologies for the preparation of thin film materials, various types of sputtering thin film materials have been widely used, therefore, the demand for sputtering targets, a functional material with high added value As a result, the demand for sputtering targets, a functional material with high added value, is increasing year by year and sputtering targets have become the most used PVD coating material in the market.
In the sputtering coating process, sputtering targets need to be installed in the machine to complete the sputtering reaction, sputtering machines are highly specialised and precise, and the market has long been monopolised by American and Japanese multinational groups.
Vacuum evaporation coating is a technique in which a substance is deposited on the surface of a substrate by heating it with an evaporation source under vacuum conditions to obtain a thin film. The substance to be evaporated is known as the evaporated material. Evaporation coating was first proposed by M. Faraday in 1857 and has been developed over a hundred years to become one of the mainstream coating technologies.
A vacuum evaporation coating system generally consists of three parts: the vacuum chamber, the evaporation source or evaporation heating device, and the device for placing and heating the substrate. In order to evaporate the material to be deposited in a vacuum, a vessel is required to support or contain the evaporate and evaporation heat is required to bring the evaporate to a high enough temperature to generate the required vapour pressure.
Vacuum evaporation coating technology is simple and convenient, easy to operate, fast film formation and other characteristics, is a widely used coating technology, mainly used in optical components, LED, flat panel display and semiconductor discrete coating. Vacuum coating materials can be divided into metal/non-metal particles, oxide evaporators and fluoride evaporators according to their chemical composition.