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PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition) are two major thin-film coating technologies. PVD vaporizes materials through physical means (e.g., heating or sputtering), resulting in strong adhesion but slower deposition rates. CVD forms coatings via chemical reactions, off
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PVD and CVD are the most commonly used surface treatment methods for tools and moulds, CVD is based on chemical vapour deposition and PVD is based on physical vapour deposition, as they differ in principle, the final coating results are different and each has its own focus in application.
Electrolytic polishing has great advantages over traditional polishing, low cost, small footprint, can polish complex workpieces, has unmatched advantages over traditional polishing.
PVD stands for Physical Vapour Deposition. PVD coating refers to a thin film deposition technique whereby solid materials are sputtered or evaporated in a vacuum environment and deposited as pure materials or alloy components to form a coating on a substrate.
Views: 33 Author: Site Editor Publish Time: 2022-05-17 Origin: Site
PVD coating processes are generally distinguished into three types, namely Vacuum Evaporation, Sputtering and Ion Plating.
1. Vacuum Evaporation
Metal in the vacuum when heated will become gas and evaporation, vacuum evaporation is the use of this principle. The treatment is mostly carried out in a vacuum below 10-5Torr, metals and various compounds can be used as the attached material, its application examples are lenses, reflective mirrors, plastic parts, etc.; but the purpose of metal surface hardening is very little, mainly used for decorative objects.
2. Sputtering
When high energy particles hit the target, the molecules or atoms in the target are struck out. The principle is to use the target as the cathode and the substrate as the anode, and when a high voltage is applied to the Ar atmosphere at around 10-2 Torr, the Ar gas near the cathode ionises and turns into Ar+, which collides with the cathode, and the molecules or atoms struck out by the Ar+ ions hit the substrate and accumulate to form a thin film.
Sputtering is used in a wide range of applications, where the function of the film is for wear resistance, corrosion resistance, heat resistance, anti-static or decorative purposes, but is rarely used in tool applications due to adhesion problems. It is suitable for bulk continuous coating, e.g. mobile phone parts.
3. Ion Plating
The most effective of the PVD coating processes is the ion plating method; this method uses an electric arc to strike the target, causing the target atoms to be excited and react with reactive gases to form a compound deposited on the surface of the workpiece. After the furnace has been operated to a high vacuum, an inert gas is introduced and biased to create argon ions (Ar+) and negatively charged electrons (e-). The positively charged argon ions will hit the substrate, which is biased to be negative, to clean the surface of the workpiece; the reactive gas is then introduced to create a slurry between the target and the substrate for coating. This method is used for coating cutting tools because of its fast film formation and good adhesion.
Most companies use the state-of-the-art cathode arc method for their coating operations. This method has a higher dissociation rate, a more uniform adhesion and an optimum density than other methods and is mostly used for hard coating of metals, especially for objects that require wear resistance.
The thickness of the vacuum coating is in the micron range, 1μm is one tenth of the thickness of conventional plating, therefore the accuracy of the workpiece is not affected by the coating process.
In general, wet plating produces a thin film layer on the surface, which tends to be flat regardless of the original shape of the substrate. PVD coatings form a layer evenly over the substrate, depending on the substrate's height and shape, and the shape of the coating follows the original substrate.
