The Ultrasonic Polishing Process

Ultrasonic polishing can be divided into the following categories according to the construction of the abrasives used and the processing method.

(1) Abrasive polishing using tools with abrasives

(2) Abrasive polishing with free abrasive grains and abrasives

(3) Dry abrasive polishing, i.e. with abrasive tools, or with abrasive tools and free state abrasive grains for direct polishing processes.

(4) wet grinding and polishing, in the above dry grinding and polishing process, adding a special abrasive solution or suspension, such as gasoline, paraffin, oil or water to do media solution, prompting the timely discharge of abrasive chips, or produce a chemical reaction conducive to polishing operations. At the same time, with the reciprocal translation of the abrasive tool, the abrasive solution or suspension also translates and flows, which also improves the polishing effect. In addition, the added abrasive solution also has a good cooling effect, which can greatly improve the service life of the abrasive tool.

When ultrasonic polishing, control the abrasive tool with appropriate static pressure on the polished surface, and make it along the surface of the parts for low-speed reciprocal relative movement. At the same time, the end of the abrasive tool in the polished surface to do about 10μm ~ 20μm amplitude of ultrasonic (usually 20kHz ~ 30kHz) vibration grinding, so as to achieve the purpose of polishing.

In the dry polishing, the abrasive grain in the ultrasonic effect, produce ultrasonic frequency vibration, coupled with the abrasive tool for non-stop relative to the surface of the system of translational movement, so that the abrasive grain on the surface of the system of grinding and cutting polishing process. This dry ultrasonic grinding and polishing method is mostly used for semi-fine or fine polishing processes. When used as a final polishing process, the polished surface can be made to have a good brightness.

When changing to wet grinding and polishing, although it can significantly improve the polishing efficiency, but the polished surface is not bright, more dull.

When polishing brittle material parts, in addition to the above abrasive grinding polishing effect, the polished surface should be polished off the rough surface layer, the impact of ultrasonic waves will produce cracks and cracks, and constantly expand and cross, and then broken off, so as to achieve the purpose of polishing.

Generally speaking, using the same abrasive, ultrasonic polishing process can achieve the extreme roughness, not as low as the manual polishing process. Therefore, in order to achieve the same level of roughness, when processing with ultrasonic polishing method, it is necessary to use a finer level of abrasive than the manual polishing process.

In the implementation of segmented polishing process, but also to do in the replacement of polishing tools and abrasives at the same time, adjust the ultrasonic polishing machine gauge. Ultrasonic polishing machine is usually equipped with four gear gauge, respectively, with four kinds of output power, according to the different circumstances of reasonable choice. The principle of adjusting the gauge is: coarse polishing processing with high power block, fine polishing operations with a small power block.

Finally, it should be noted that the high frequency of the ultrasonic polishing process, so that special abrasives in the polished surface to produce a huge high-speed grinding and polishing energy, it can be quickly polished on the high hardness of the surface layer processing. For semiconductor wafers with low roughness, ultrasonic enhanced chemical-mechanical polishing can be used.