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PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition) are two major thin-film coating technologies. PVD vaporizes materials through physical means (e.g., heating or sputtering), resulting in strong adhesion but slower deposition rates. CVD forms coatings via chemical reactions, off
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PVD and CVD are the most commonly used surface treatment methods for tools and moulds, CVD is based on chemical vapour deposition and PVD is based on physical vapour deposition, as they differ in principle, the final coating results are different and each has its own focus in application.
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PVD stands for Physical Vapour Deposition. PVD coating refers to a thin film deposition technique whereby solid materials are sputtered or evaporated in a vacuum environment and deposited as pure materials or alloy components to form a coating on a substrate.
Views: 40 Author: Site Editor Publish Time: 2022-06-20 Origin: Site
Thin film deposition is a very important technology in the semiconductor manufacturing process, which is a series of processes involving the adsorption of atoms, the diffusion of adsorbed atoms on the surface and the agglomeration of the atoms at the appropriate locations to gradually form thin films and grow. Thin film deposition processes are divided into two main categories: physical vapour deposition and chemical vapour deposition. The principles of physical vapour deposition can be broadly divided into evaporation coating, sputtering coating and ion plating, and specifically include various coating techniques such as MBE. At present, physical vapour deposition techniques can be used to deposit not only metal and alloy films, but also compounds, ceramics, semiconductors, polymer films, etc.
With the development of technology, PVD technology is constantly evolving and many specialised technologies have emerged for certain applications, here is an overview of the various PVD technologies.
Vacuum Evaporation Coating Technology
Vacuum evaporation coating is a vacuum coating method in which the evaporated material is heated by an evaporator under vacuum conditions, causing it to sublimate and a stream of evaporated particles is shot directly at the substrate and deposited on the substrate to form a solid film, or heated evaporation coating material.
Electron Beam Vapour Deposition Technology
Electron beam vapour depositionis a type of physical vapour deposition. Unlike conventional vapour deposition, electron beam vapour deposition uses electromagnetic fields to precisely bombard the crucible with high-energy electrons to melt the target material and deposit it on the substrate.
The main advantages of electron beam vapour deposition compared to resistance vapour deposition are that it provides higher heat for the material to be vaporised and therefore faster vapour deposition rates, and that the electron beam is precisely positioned to avoid evaporation and contamination of the crucible material.
Sputter coating technology
Sputter coating technology is a phenomenon where the atoms of a target are knocked out of the target by bombarding the surface with ions called sputtering. The atoms produced by the sputtering are deposited on the surface of the substrate to form a film called a sputter coating. Usually a gas discharge is used to produce gas ionisation and its positive ions bombard the cathode target at high speed under the action of an electric field, knocking out atoms or molecules of the cathode target and depositing them on the surface of the substrate to be coated into a thin film.
Radio Frequency Sputtering Technology
Radio frequency sputtering is a type of sputter coating technology. Using an AC power supply instead of a DC power supply constitutes an AC sputtering system. Since the commonly used AC power supply has a frequency in the RF band, e.g. 13.56 MHz, it is called RF sputtering.
Magnetron sputtering technology
Magnetron sputtering is a type of PVD (Physical Vapour Deposition) technology and is one of the most important methods for preparing thin film materials. It uses the characteristics of charged particles with a certain kinetic energy when accelerated in an electric field to direct ions towards a target electrode (cathode) made of the sputtered material and sputter the target atoms so that they move in a certain direction to the substrate and are deposited on the substrate to form a film. Magnetron sputtering equipment enables controlled coating thickness and uniformity, and the prepared films are dense, strongly bonded and pure. This technology has become an important tool for the preparation of various functional films.
Ion coating technology
Ion plating is a new coating technology developed on the basis of vacuum evaporation plating and sputtering plating, introducing various gas discharge methods into the field of vapour phase deposition, where the entire vapour phase deposition process is carried out in a plasma, including magnetron sputtering ion plating, reactive ion plating, hollow cathode discharge ion plating (hollow cathode vapour plating method), multi-arc ion plating (cathode arc ion plating), etc. Ion plating greatly increases the energy of the particles in the film layer, allowing for better performance of the film layer and expanding the field of application of "thin films". It is a rapidly developing and popular new technology.
Multi-Arc Ion Plating (MAIP)
Multi-Arc Ion Plating is a method of depositing a thin film on the surface of a substrate by directly evaporating metal on a solid cathode target using an electric arc discharge of ions of cathode material emitted from the cathode arc glow point.
Molecular Beam Epitaxy (MBE)
Molecular beam epitaxy (MBE) is a newly developed method of epitaxial film production and is a new technique for growing high quality crystalline films on crystal substrates. Under ultra-high vacuum conditions, a molecular or atomic beam is created by heating a furnace with the required components, collimated by small holes, and sprayed directly onto a single crystal substrate at the appropriate temperature, while the beam is scanned against the substrate in a controlled manner, allowing the molecules or atoms to "grow" layer by layer in a crystalline arrangement to form a thin film on the substrate.
Pulsed Laser Deposition (PLD)
Pulsed Laser Deposition (PLD), also known as pulsed laser ablation (PLA), is a means of using a laser to bombard an object and then depositing the bombarded material onto a different substrate to obtain a deposit or thin film.
Laser Molecular Beam Epitaxy (L-MBE)
Laser Molecular Beam Epitaxy (L-MBE) is a new thin film preparation technology developed in recent years, combining molecular beam epitaxy with pulsed laser deposition and laser evaporation coating under molecular beam epitaxy conditions.
L- MBE is an improved MBE method combining the high instantaneous deposition rates of PLD (without the need to consider the thermal equilibrium of component volatilisation, etc.) with the real-time inspection capabilities of MBE.
