PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition) are two major thin-film coating technologies. PVD vaporizes materials through physical means (e.g., heating or sputtering), resulting in strong adhesion but slower deposition rates. CVD forms coatings via chemical reactions, off
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PVD and CVD are the most commonly used surface treatment methods for tools and moulds, CVD is based on chemical vapour deposition and PVD is based on physical vapour deposition, as they differ in principle, the final coating results are different and each has its own focus in application.
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PVD stands for Physical Vapour Deposition. PVD coating refers to a thin film deposition technique whereby solid materials are sputtered or evaporated in a vacuum environment and deposited as pure materials or alloy components to form a coating on a substrate.
Views: 28 Author: Site Editor Publish Time: 2022-06-23 Origin: Site
PVD, like water plating, both belong to the category of surface treatment, and both are used to make one material cover the surface of another material in a certain way to obtain a layer or multiple layers of film with decorative effect or with certain functions (wear resistance, corrosion resistance, heat resistance, electrical conductivity, etc.).
1. Environmentally friendly. Vacuum coating is carried out in a vacuum furnace, which does not produce toxic or polluting substances and gases and has no negative impact on the environment, whereas water plating is carried out in a solution containing the plated metal, which can cause serious environmental pollution.
2. Cost. Water plating is a simpler process and the requirements from equipment to environment are not as demanding as PVD, so water plating has an advantage in terms of cost.
3. Plating properties. Under the same film thickness, the adhesion between the PVD coating layer and the surface of the workpiece is greater, and it can be bent over 90 degrees without cracking or peeling, and the hardness of the film layer is higher, with better wear resistance and corrosion resistance, and the performance of the film layer is more stable; however, usually, the film thickness of water plating is thicker than that of vacuum plating, and the thickness of water plating is generally 15-20um, while the film thickness of vacuum plating is generally 0.3μm ~The thickness of the decorative coating layer is generally 0.3μm~1μm, therefore, in order to ensure the adhesion of the vacuum coating, all need to be followed by special spraying treatment, such as a layer of UV oil.
4. The types and colours of film layers. Water plating can only be plated with metal and alloy, and the colours are monotonous, usually only sub-silver, grey silver, gunmetal, gold, black chrome, semi-glossy chrome, etc.; PVD coating can be plated with a wider range of film layers (including metal and non-metal), and can be plated in a variety of colours, even flash silver, magic blue, crackle, teardrop silver, etc. or seven colours.
5. Range of material adaptations. In addition to ABS and ABS+PC, vacuum plating can also be applied to PC, PP, PMMA, PA, PS, PET and other common engineering materials. With the development of mature technology, vacuum plating can be applied to soft plastics such as TPU, TPE, PVC, silicone, rubber products, etc.
6. One-sidedness of the plating. PVD can be applied to the outer surface of the workpiece alone, or to the inner surface of the workpiece alone, while the other surface retains the original appearance and function of the plastic.
7. Conductivity of the plating. PVD allows precise control of the layer thickness and allows for both conductive and non-conductive vacuum plating (NCVM), whereas water plating has an inherently thicker layer and cannot be non-conductive.
8. Differences in film shape of the plating. Generally, the coating produced by wet plating is covered with a thin film layer, which tends to be flat regardless of the original shape of the substrate. The PVD coating forms an even layer on the top depending on the shape of the substrate, which varies according to the height and shape of the substrate, and then follows the shape of the original substrate.